DIE CUTTING & EMBOSSING-DIE BRUSH AND FOAM PAD FOR WAFER THIN DIES 660513 1PK SIZZIX
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Die Brush And Foam Pad - For Wafer Thin Dies

Regular Price: ₹999.00

Special Price ₹200.00

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Product Features and Application
When it comes to removing excess paper in all brands of wafer-thin, chemically-etched dies, the Sizzix Die Brush does it easily and ergonomically. With a sleek, ergonomic rubber-grip handle for non-slippage and easy maneuverability, the Die Brush easily rolls away excess paper to reveal the perfect cut! The Die Brush includes a Foam Pad that acts as the perfect work surface for removing excess paper from the dies and even the cutout.

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